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Investigating thermal design of silicon carbide power modules for motor drive in electrical vehicle application

A recent study investigates the thermal design of silicon carbide (SiC) power modules for motor drives in electric vehicles, with a focus on optimizing the layout of Pinfin structures to enhance thermal performance. The work explores the impact of irregularly arranged Pinfins on reducing thermal resistance and temperature differences within power modules.

The research also introduces a collaborative thermal design strategy that includes DC bus capacitors and motors, aiming to improve overall heat dissipation. The paper contributes to the development of high power density motor drives by providing essential insights and optimization methods for thermal management in electric vehicle applications.

The research is published in the journal CES Transactions on Electrical Machines and Systems.

The paper reviews the thermal design of silicon carbide (SiC) power modules used in electric vehicle (EV) motor drives, highlighting the challenges and advancements in optimizing irregularly arranged Pinfin structures. The authors emphasize that current thermal design practices rely heavily on empirical knowledge, which limits the performance of power modules. The study explores how irregular Pinfin layouts can enhance thermal characteristics by reducing thermal resistance and minimizing temperature differentials among chips.

Pinfin configurations in power modules are currently designed with either single-sided or double-sided, and the typical products is shown in Fig. 1. The performance of Pinfin cooling still has considerable potential for improvement, which can effectively promote the performance of SiC devices. Credit: CES Transactions on Electrical Machines and Systems (CES TEMS)

The paper outlines a two-step optimization approach: first, generating unique irregular Pinfin layouts using algorithms to improve design quality; second, efficiently evaluating these layouts to ensure simulation accuracy and speed. The authors also propose collaborative thermal design involving DC bus capacitors and motors to improve overall heat dissipation effectiveness.

Key findings indicate that irregular Pinfin arrangements can significantly enhance heat transfer efficiency and reduce pressure drops compared to regular layouts. The paper emphasizes the need for innovative cooling solutions and advanced modeling techniques to address the complex thermal dynamics in EV applications. The research outcomes aim to support the development of high-powered motor drives, ultimately contributing to the advancement of electric vehicle technology.

It is hoped that the quantitative representation and automatic generation methods of Pinfin layout schemes, efficient evaluation methods and collaborative thermal design can be completed in the future. The main design goal is to reduce the thermal resistance to the shell and reduce the temperature difference between the chips.

The optimization of thermal management of power modules for future electric vehicles may involve a balance between innovative design, practical manufacturing processes and economic feasibility. In the future, driven by EV technology's relentless pursuit of efficiency and performance, these optimizations are likely to become more transparent and standardized, allowing for wider industry adoption and competition.

Provided by CES Transactions on Electrical Machines and Systems